USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions.

As AI data centres continue to scale, token generation is limited by power availability, while efficiency is a defining factor for return on investment. Traditional architectures based on bulky, ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.

Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV‑D3 mSiC® Power Modules, designed to ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

Wolfspeed has introduced two new 3.3 kV silicon carbide (SiC) power module families – including high-power half-bridge ...

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...

Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers ...

Microchip Technology has launched a new range of 3.3 kV silicon carbide (SiC) power modules to support SST designs.

Engineers at the Department of Energy’s Oak Ridge National Laboratory have developed a new ...

Wolfspeed’s 3.3-kV SiC power modules target AI data centers, renewable energy systems, and grid infrastructure.