Researchers stack silicon circuits vertically to build 3D chips that could extend Moore's law beyond current limits.

And it cost a whole lot less than an Amazon Echo.

A new method called PackUV compresses massive 3D video data into everyday video formats, potentially bringing immersive video experiences closer to home televisions and computers.

Abstract: Time difference of arrival (TDOA) and direction of arrival (DOA) are, respectively, applied to detect partial discharge (PD) target with ultrasonic signal. The reason why these two methods ...

AWS is also investing in the longer-term hardware path. In February 2025, Amazon announced Ocelot, a quantum computing chip developed by the AWS Center for Quantum Computing. Ocelot uses a ...

Samsung 900-layer NAND prototype — the world’s first — uses Cell Multi-Bonding to fuse two 450-layer wafers into one chip, ...

If you're looking for the best way to play your old Nintendo games but don't have original hardware, these retro-inspired ...

Japan’s Kioxia has set the mass production of its next-generation NAND flash memory as a top priority for next year — a move ...

Huawei unveiled 122TB enterprise SSDs using Die-on-Board packaging that boosts density 33%, working around US export controls ...

Infleqtion is one of the leaders in applying the neutral atom modality to quantum computing delivering room-temperature scalable quantum computing.

This sponsored article is brought to you by Applied Materials. At pivotal moments in history, progress has required more than ...

A global overview of the state of youth development, using the most up-to-date comparative data to offer insights and illustrate trends across a range of indicators covering the period 2010–2022. The ...