High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
Abstract: The applications of wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) in power modules are currently limited by the thermal stability of ...
Abstract: Remote-sensing (RS) images present unique challenges for computer vision (CV) due to lower resolution, smaller objects, and fewer features. Mainstream backbone networks show promising ...
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