IEEE

Structural Characterization of 2.5D System in Package Combined with High Bandwidth Memory for Enhanced Quality and Reliability

Abstract: 2.5D body size is expanding due to SoC/HBM system integration to maximize artificial intelligence (AI) performance. Accordingly, thermal and mechanical stress caused by large body size is ...
IEEE

Integrated Package-to-System Thermal Solution Evolution for High-Performance 2.5D CoWoS-R Advanced Packaging Technology Development

Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
Windows Report

Microsoft’s First-Ever Voluntary Retirement Package Details Out Now, Check What’s Being Offered

Per the report, around 7 percent of Microsoft’s US workforce, roughly 8,750 employees, are reportedly qualified for the offer. Microsoft employees in the US whose age and years of service combine to ...
Wall Street Journal

Kraft Heinz CEO Pushes Value: ‘Consumers Are Literally Running Out of Money’

Kraft Heinz’s KHC1.06%increase; green up pointing triangle new Chief Executive Steve Cahillane has a new mantra: value. The packaged food behemoth—the one that was splitting up and now might not—is ...